Day: 11. April 2017

Dai Nippon Printing develops low-cost flexible sensor which measures the strain of bridges

In collaboration with the National Institute of Advanced Industrial Science and Technology, Dai Nippon Printing Co., Ltd. has devised a technology to integrate silicon sensors and ultra thin circuit chips (size 5 mm x 1 mm, thickness 3 μm) by MEMS technology on a flexible substrate. This sensor can measure and transduce the dynamic strain […]

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