In collaboration with the National Institute of Advanced Industrial Science and Technology, Dai Nippon Printing Co., Ltd. has devised a technology to integrate silicon sensors and ultra thin circuit chips (size 5 mm x 1 mm, thickness 3 μm) by MEMS technology on a flexible substrate. This sensor can measure and transduce the dynamic strain distribution into a voltage signal when a car passes over a bridge with high sensitivity.

NEDO news release, April 11, 2017